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Which
is the process step that follows resist
exposure, is done to leave behind the correct resist
pattern on the wafer which will serve as the physical mask that covers areas on the wafer that need to be
protected from chemical attack during subsequent etching,
implantation, lift-off, and the like. The development process involves
chemical reactions
wherein unprotected parts of the resist
get dissolved in the developer. A good development process has a short
duration (less than a minute), results in minimum pattern distortion or
swelling, keeps the original film thickness of protected areas intact, and
recreates the intended pattern faithfully. Development is carried out either
by immersion developing, spray developing, or puddle developing. Regardless
of method used, it should always be followed by thorough rinsing and drying
to ensure that the development action will not continue after the developer
has been removed from the wafer surface.
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