Development

 

Which is the process step that follows resist exposure, is done to leave behind the correct resist pattern on the wafer which will serve as the physical mask that covers areas on the wafer that need to be protected from chemical attack during subsequent etching, implantation, lift-off, and the like. The development process involves chemical reactions wherein unprotected parts of the resist get dissolved in the developer. A good development process has a short duration (less than a minute), results in minimum pattern distortion or swelling, keeps the original film thickness of protected areas intact, and recreates the intended pattern faithfully. Development is carried out either by immersion developing, spray developing, or puddle developing. Regardless of method used, it should always be followed by thorough rinsing and drying to ensure that the development action will not continue after the developer has been removed from the wafer surface.

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