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A
novel technique for accurately assembling large numbers of very small
devices. The small size, planarity, and accuracy of the assembly also result
in very low parasitic interconnects, comparable to on die traces. This
massively parallel assembly process combines the capability and flexibility
of assembly with the cost effectiveness of integration. [MIT EECS] Invented
by Mr. Mark Hadley and was part of his Ph.D. Dissertation while he was
studying at University of California, Berkley. The FSA process became the
foundation for the origins of a new company named Alien Technology Corporation. In the FSA process,
specifically shaped semiconductor devices ranging in size from 10 microns to several hundred microns
are suspended in liquid and flowed over a surface which has correspondingly
shaped "holes" or receptors
on it and into which the devices settle. The shape of the devices and of the
holes is designed so that the devices fall easily into place and are
selfaligning. Alien has successfully demonstrated the assembly of tens of
thousands of devices in a single process step.
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